chiplet

Small integrated circuits designed to work together to form a larger, more complex chip. They offer advantages such as improved yields, lower costs, and customization, with advancements in packaging technologies like 2.5D Si TSV interposer, Fanout RDL interposer, and 3D hybrid bonding packaging. The chiplet technology primarily benefits semiconductor manufacturers and industries seeking higher performance, higher bandwidth, and lower power consumption at a more manageable cost.